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1. general description the 74ahc245; 74ahct245 is a high-speed si-gate cmos device. the 74ahc245; 74ahct245 is an octal transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. the 74ahc245; 74ahct245 features an output enable input ( oe), for easy cascading, and a send and receive direction control input (dir). oe controls the outputs so that the buses are effectively isolated. 2. features n balanced propagation delays n all inputs have schmitt-trigger actions n inputs accept voltages higher than v cc n input levels: u for 74ahc245: cmos level u for 74ahct245: ttl level n esd protection: u hbm eia/jesd22-a114e exceeds 2000 v u mm eia/jesd22-a115-a exceeds 200 v u cdm eia/jesd22-c101c exceeds 1000 v n multiple package options n speci?ed from - 40 c to +85 c and from - 40 c to +125 c 3. ordering information 74ahc245; 74ahct245 octal bus transceiver; 3-state rev. 05 28 april 2009 product data sheet table 1. ordering information type number package temperature range name description version 74ahc245d - 40 c to +125 c so20 plastic small outline package; 20 leads; body width 7.5 mm sot163-1 74AHCT245D 74ahc245pw - 40 c to +125 c tssop20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 74ahct245pw 74ahc245bq - 40 c to +125 c dhvqfn20 plastic dual in-line compatible thermal enhanced very thin quad ?at package; no leads; 20 terminals; body 2.5 4.5 0.85 mm sot764-1 74ahct245bq
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 2 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 4. functional diagram fig 1. logic symbol fig 2. iec logic symbol 2 1 dir 18 19 b0 b1 b2 b3 b4 b5 b6 b7 3 17 4 16 5 15 6 14 7 13 8 12 9 a0 a1 a2 a3 a4 a5 a6 a7 11 oe mna174 17 3 1 19 2 1 16 4 15 5 14 6 13 7 12 8 11 9 18 g3 3en1 3en2 2 mna175
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 3 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 5. pinning information 5.1 pinning 5.2 pin description (1) the die substrate is attached to this pad using conductive die attach material. it can not be used as a supply pin or input. fig 3. pin con?guration so20, tssop20 fig 4. pin con?guration dhvqfn20 74ahc245 74ahct245 dir v cc a0 oe a1 b0 a2 b1 a3 b2 a4 b3 a5 b4 a6 b5 a7 b6 gnd b7 001aak037 1 2 3 4 5 6 7 8 9 10 12 11 14 13 16 15 18 17 20 19 001aak038 74ahc245 74ahct245 transparent top view b6 a6 a7 b5 a5 b4 a4 b3 a3 b2 a2 b1 a1 b0 a0 oe gnd b7 dir v cc 9 12 8 13 7 14 6 15 5 16 4 17 3 18 2 19 10 11 1 20 terminal 1 index area gnd (1) table 2. pin description symbol pin description dir 1 direction control input a0 2 data input/output a1 3 data input/output a2 4 data input/output a3 5 data input/output a4 6 data input/output a5 7 data input/output a6 8 data input/output a7 9 data input/output gnd 10 ground (0 v) b7 11 data input/output b6 12 data input/output b5 13 data input/output b4 14 data input/output b3 15 data input/output b2 16 data input/output
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 4 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 6. functional description [1] h = high voltage level; l = low voltage level; x = dont care; z = high-impedance off-state. 7. limiting values [1] the input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] for so20 packages: above 70 c the value of p tot derates linearly at 8 mw/k. for tssop20 packages: above 60 c the value of p tot derates linearly at 5.5 mw/k. for dhvqfn20 packages: above 60 c the value of p tot derates linearly at 4.5 mw/k. b1 17 data input/output b0 18 data input/output oe 19 output enable input (active low) v cc 20 supply voltage table 2. pin description continued symbol pin description table 3. function table [1] control input/output oe dir an bn l l a = b inputs l h inputs b = a hxz z table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage - 0.5 +7.0 v v i input voltage - 0.5 +7.0 v i ik input clamping current v i < - 0.5 v [1] - 20 - ma i ok output clamping current v o < - 0.5 v or v o >v cc + 0.5 v [1] - 20 +20 ma i o output current v o = - 0.5 v to (v cc + 0.5 v) - 25 +25 ma i cc supply current - +75 ma i gnd ground current - 75 - ma t stg storage temperature - 65 +150 c p tot total power dissipation t amb = - 40 c to +125 c [2] - 500 mw
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 5 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 8. recommended operating conditions 9. static characteristics table 5. operating conditions symbol parameter conditions min typ max unit 74ahc245 v cc supply voltage 2.0 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 3.0 v to 3.6 v - - 100 ns/v v cc = 4.5 v to 5.5 v - - 20 ns/v 74ahct245 v cc supply voltage 4.5 5.0 5.5 v v i input voltage 0 - 5.5 v v o output voltage 0 - v cc v t amb ambient temperature - 40 +25 +125 c d t/ d v input transition rise and fall rate v cc = 4.5 v to 5.5 v - - 20 ns/v table 6. static characteristics at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max 74ahc245 v ih high-level input voltage v cc = 2.0 v 1.5 - - 1.5 - 1.5 - v v cc = 3.0 v 2.1 - - 2.1 - 2.1 - v v cc = 5.5 v 3.85 - - 3.85 - 3.85 - v v il low-level input voltage v cc = 2.0 v - - 0.5 - 0.5 - 0.5 v v cc = 3.0 v - - 0.9 - 0.9 - 0.9 v v cc = 5.5 v - - 1.65 - 1.65 - 1.65 v v oh high-level output voltage v i = v ih or v il i o = - 50 m a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = - 50 m a; v cc = 3.0 v 2.9 3.0 - 2.9 - 2.9 - v i o = - 50 m a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = - 4.0 ma; v cc = 3.0 v 2.58 - - 2.48 - 2.40 - v i o = - 8.0 ma; v cc = 4.5 v 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il i o = 50 m a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 m a; v cc = 3.0 v - 0 0.1 - 0.1 - 0.1 v i o = 50 m a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 3.0 v - - 0.36 - 0.44 - 0.55 v i o = 8.0 ma; v cc = 4.5 v - - 0.36 - 0.44 - 0.55 v
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 6 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state i i input leakage current v i = 5.5 v or gnd; v cc = 0 v to 5.5 v - - 0.1 - 1.0 - 2.0 m a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd; v cc = 5.5 v -- 0.25 - 2.5 - 10.0 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - - 4.0 - 40 - 80 m a c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf 74ahct245 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 - - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - - 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = - 50 m a 4.4 4.5 - 4.4 - 4.4 - v i o = - 8.0 ma 3.94 - - 3.80 - 3.70 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 50 m a - 0 0.1 - 0.1 - 0.1 v i o = 8.0 ma - - 0.36 - 0.44 - 0.55 v i i input leakage current v i = 5.5 v or gnd; v cc = 0 v to 5.5 v - - 0.1 - 1.0 - 2.0 m a i oz off-state output current v i =v ih or v il ; v o =v cc or gnd per input pin; other inputs at v cc or gnd; i o = 0 a; v cc = 5.5 v -- 0.25 - 2.5 - 10.0 m a i cc supply current v i =v cc or gnd; i o = 0 a; v cc = 5.5 v - - 4.0 - 40 - 80 m a d i cc additional supply current per input pin; v i =v cc - 2.1 v; other pins at v cc or gnd; i o = 0 a; v cc = 4.5 v to 5.5 v - - 1.35 - 1.5 - 1.5 ma c i input capacitance v i =v cc or gnd - 3 10 - 10 - 10 pf c o output capacitance -4- - - - -pf table 6. static characteristics continued at recommended operating conditions; voltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ max min max min max
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 7 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 10. dynamic characteristics table 7. dynamic characteristics voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 . symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max min max 74ahc245 t pd propagation delay an to bn; bn to an; see figure 5 [2] v cc = 3.0 v to 3.6 v c l = 15 pf - 5.0 8.4 1.0 10.0 1.0 10.5 ns c l = 50 pf - 6.5 11.9 1.0 13.5 1.0 15.0 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 3.5 5.5 1.0 6.5 1.0 7.0 ns c l = 50 pf 5.0 7.5 1.0 8.5 1.0 9.5 ns t en enable time oe to an; oe to bn; signal name dir; see figure 6 [3] v cc = 3.0 v to 3.6 v c l = 15 pf - 6.5 13.2 1.0 15.5 1.0 16.5 ns c l = 50 pf - 9.0 16.7 1.0 19.0 1.0 21.0 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 4.0 8.5 1.0 10.0 1.0 11.0 ns c l = 50 pf - 5.0 10.6 1.0 12.0 1.0 13.5 ns t dis disable time oe to an; oe to bn; signal name dir; see figure 6 [4] v cc = 3.0 v to 3.6 v c l = 15 pf - 7.5 12.5 1.0 15.5 1.0 16.0 ns c l = 50 pf - 10.0 15.8 1.0 18.0 1.0 20.0 ns v cc = 4.5 v to 5.5 v c l = 15 pf - 4.5 7.8 1.0 9.2 1.0 10.0 ns c l = 50 pf - 6.0 9.7 1.0 11.0 1.0 12.5 ns c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [5] -12- - - - -pf 74ahct245; v cc = 4.5 v to 5.5 v t pd propagation delay an to bn; bn to an; see figure 5 [2] c l = 15 pf - 3.5 7.7 1.0 8.5 1.0 10.0 ns c l = 50 pf - 4.5 8.7 1.0 9.5 1.0 11.0 ns t en enable time oe to an; oe to bn; signal name dir; see figure 6 [3] c l = 15 pf - 5.0 13.8 1.0 15.0 1.0 17.5 ns c l = 50 pf - 6.0 14.8 1.0 16.0 1.0 18.5 ns
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 8 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state [1] typical values are measured at nominal supply voltage (v cc = 3.3 v and v cc = 5.0 v). [2] t pd is the same as t plh and t phl . [3] t en is the same as t pzl and t pzh . [4] t dis is the same as t plz and t phz . [5] c pd is used to determine the dynamic power dissipation (p d in m w). p d =c pd v cc 2 f i n+ s (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; c l = output load capacitance in pf; v cc = supply voltage in v; n = number of inputs switching; s (c l v cc 2 f o ) = sum of the outputs. 10.1 waveforms t dis disable time oe to an; oe to bn; signal name dir; see figure 6 [4] c l = 15 pf - 5.0 14.4 1.0 15.5 1.0 18.0 ns c l = 50 pf - 6.0 15.4 1.0 16.5 1.0 19.5 ns c pd power dissipation capacitance f i = 1 mhz; v i = gnd to v cc [5] -15- - - - -pf table 7. dynamic characteristics continued voltages are referenced to gnd (ground = 0 v); for test circuit see figure 7 . symbol parameter conditions 25 c - 40 c to +85 c - 40 c to +125 c unit min typ [1] max min max min max measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 5. input to output propagation delays mna176 an, bn input bn, an output t plh t phl gnd v i v m v m v m v m v oh v ol
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 9 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state measurement points are given in t ab le 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 6. enable and disable times mna367 t plz t phz outputs disabled outputs enabled v y v x outputs enabled output low-to-off off-to-low output high-to-off off-to-high oe input v i v ol v oh v cc v m gnd gnd t pzl t pzh v m v m table 8. measurement points type input output v m v m v x v y 74ahc245 0.5 v cc 0.5 v cc v ol + 0.3 v v oh - 0.3 v 74ahct245 1.5 v 0.5 v cc v ol + 0.3 v v oh - 0.3 v
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 10 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state test data is given in t ab le 9 . de?nitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. r l = load resistance. s1 = test selection switch. fig 7. load circuitry for measuring switching times v m v m t w t w 10 % 90 % 0 v v i v i negative pulse positive pulse 0 v v m v m 90 % 10 % t f t r t r t f 001aad983 dut v cc v cc v i v o r t r l s1 c l open g table 9. test data type input load s1 position v i t r , t f c l r l t phl , t plh t pzh , t phz t pzl , t plz 74ahc245 v cc 3.0 ns 15 pf, 50 pf 1 k w open gnd v cc 74ahct245 3.0 v 3.0 ns 15 pf, 50 pf 1 k w open gnd v cc
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 11 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 11. package outline fig 8. package outline sot163-1 (so20) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p q z y w v q references outline version european projection issue date iec jedec jeita mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 13.0 12.6 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 sot163-1 10 20 w m b p detail x z e 11 1 d y 0.25 075e04 ms-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.51 0.49 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 0 5 10 mm scale x q a a 1 a 2 h e l p q e c l v m a (a ) 3 a so20: plastic small outline package; 20 leads; body width 7.5 mm sot163-1 99-12-27 03-02-19
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 12 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state fig 9. package outline sot360-1 (tssop20) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v q references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot360-1 mo-153 99-12-27 03-02-19 w m b p d z e 0.25 110 20 11 pin 1 index q a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm sot360-1 a max. 1.1
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 13 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state fig 10. package outline sot764-1 (dhvqfn20) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 4.6 4.4 d h 3.15 2.85 y 1 2.6 2.4 1.15 0.85 e 1 3.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot764-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot764-1 dhvqfn20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 20 terminals; body 2.5 x 4.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 29 19 12 11 10 1 20 x d e c b a terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 14 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 12. abbreviations 13. revision history table 10. abbreviations acronym description cdm charged device model cmos complementary metal-oxide semiconductor dut device under test esd electrostatic discharge hbm human body model mm machine model ttl transistor-transistor logic table 11. revision history document id release date data sheet status change notice supersedes 74ahc_ahct245_5 20090428 product data sheet - 74ahc_ahct245_4 modi?cations: ? section 3 : dhvqfn20 package added. ? section 7 : derating values added for dhvqfn20 package. ? section 11 : outline drawing added for dhvqfn20 package. 74ahc_ahct245_4 20080425 product data sheet - 74ahc_ahct245_n_3 74ahc_ahct245_n_3 20070925 product data sheet - 74ahc_ahct245_2 74ahc_ahct245_2 19990928 product speci?cation - 74ahc_ahct245_1 74ahc_ahct245_1 19980921 product speci?cation - -
74ahc_ahct245_5 ? nxp b.v. 2009. all rights reserved. product data sheet rev. 05 28 april 2009 15 of 16 nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state 14. legal information 14.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term short data sheet is explained in section de?nitions. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple dev ices. the latest product status information is available on the internet at url http://www .nxp .com . 14.2 de?nitions draft the document is a draft version only. the content is still under internal review and subject to formal approval, which may result in modi?cations or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. short data sheet a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request via the local nxp semiconductors sales of?ce. in case of any inconsistency or con?ict with the short data sheet, the full data sheet shall prevail. 14.3 disclaimers general information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes nxp semiconductors reserves the right to make changes to information published in this document, including without limitation speci?cations and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. applications applications that are described herein for any of these products are for illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the speci?ed use without further testing or modi?cation. limiting values stress above one or more limiting values (as de?ned in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale nxp semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www .nxp .com/pro? le/ter ms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or con?ict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 14.4 trademarks notice: all referenced brands, product names, service names and trademarks are the property of their respective owners. 15. contact information for more information, please visit: http://www .nxp.com for sales of?ce addresses, please send an email to: salesad dresses@nxp.com document status [1] [2] product status [3] de?nition objective [short] data sheet development this document contains data from the objective speci?cation for product development. preliminary [short] data sheet quali?cation this document contains data from the preliminary speci?cation. product [short] data sheet production this document contains the product speci?cation.
nxp semiconductors 74ahc245; 74ahct245 octal bus transceiver; 3-state ? nxp b.v. 2009. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com date of release: 28 april 2009 document identifier: 74ahc_ahct245_5 please be aware that important notices concerning this document and the product(s) described herein, have been included in section legal information. 16. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 functional description . . . . . . . . . . . . . . . . . . . 4 7 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 recommended operating conditions. . . . . . . . 5 9 static characteristics. . . . . . . . . . . . . . . . . . . . . 5 10 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 10.1 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 11 package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 12 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . 14 14 legal information. . . . . . . . . . . . . . . . . . . . . . . 15 14.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 15 14.2 de?nitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 14.4 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 15 contact information. . . . . . . . . . . . . . . . . . . . . 15 16 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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